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BGA Reballing Stencil Kit 0.12mm Thickness MTK Power IC Chip Tin Mesh Solder Template MT-1 MKT

China
Price=1,100
b410
In stock
+

19 In 1 BGA Reballing Stencil Kit 0.12mm Thickness MTK Power IC Chip Tin Mesh Solder Template for MT6311P MT6339A MT6155A MT662

Features Of BGA Reballing Stencil Kit 0.12mm Thickness MTK Power IC Chip Tin Mesh Solder Template MT-1 MKT:

  • 100% brand and high quality.
  • These stencils can be heated by the hot air machine, it is easy and quick for Reballing the BGA IC.
  • Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
  • With the high success rate of planting tin, the solder balls can be formed once when you are proficient.
  • Simple and convenient to use.

Package Includes:

  • 1 x BGA Reballing Stencil Kit 0.12mm Thickness MTK Power IC Chip

Best online shopping website for BGA Reballing Stencil Kit 0.12mm Thickness MTK Power IC Chip Tin Mesh Solder Template MT-1 MKT at a cheap price in Lahore, Islamabad, Karachi, Faisalabad, Multan, Quetta, Sukkur, Peshawar, Rawalpindi ad all over Pakistan.

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