BGA Stencil MSM8992 CPU Reball Tin Template for LG LG G2 G3 G4 H790 V10 H968 VS986 LS990

Rs. 1,500
B302,IMP,Th,KRT
Out of stock
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Description

BGA rework stencil kits, a quality solder paste stencil solution. A ball grid array is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.

Features:

  • deformation resistant material
  • Location of precise pins

Note:

  • Make sure you know how to install and replace this item, it is not an easy job for someone who does not have technical skills with disassembly or assembly of cell phones / mobile phones
  • Highly recommend professional installation, use professional tools for replacement, we will not be responsible for any damage to your cell phone / mobile phone that may cause improper operation! 

Package Includes:

1 x BGA Stencil MSM8992 

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